JPH0121561Y2 - - Google Patents
Info
- Publication number
- JPH0121561Y2 JPH0121561Y2 JP1982143773U JP14377382U JPH0121561Y2 JP H0121561 Y2 JPH0121561 Y2 JP H0121561Y2 JP 1982143773 U JP1982143773 U JP 1982143773U JP 14377382 U JP14377382 U JP 14377382U JP H0121561 Y2 JPH0121561 Y2 JP H0121561Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor plate
- metal conductor
- fet
- microwave transistor
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 238000005476 soldering Methods 0.000 claims description 16
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000009434 installation Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982143773U JPS5948049U (ja) | 1982-09-22 | 1982-09-22 | マイクロ波トランジスタの取付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982143773U JPS5948049U (ja) | 1982-09-22 | 1982-09-22 | マイクロ波トランジスタの取付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948049U JPS5948049U (ja) | 1984-03-30 |
| JPH0121561Y2 true JPH0121561Y2 (en]) | 1989-06-27 |
Family
ID=30320825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982143773U Granted JPS5948049U (ja) | 1982-09-22 | 1982-09-22 | マイクロ波トランジスタの取付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948049U (en]) |
-
1982
- 1982-09-22 JP JP1982143773U patent/JPS5948049U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948049U (ja) | 1984-03-30 |
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